Photoresist Coating Systems for MEMs and Semiconductor
Siansonic ultrasonic spray coating technology can provide a solution to create the highly uniform photoresist coatings on wafers, MEMs, glass etc.. Compared with conventional spin coating and dip coating, ultrasonic coating can offer better film on micro-structures and no limit on substrate size.
Siansonic's spray coating systems can deal with both flat and 2.5D/3D substrates including silicone wafers, glass, metal, ceramic, plastic, etc.
Uniform coatings on both flat and 3D micro-structures.
No limitation on substrate size.
Low cost on maintenance.
High transfer efficiency of raw material.
Highly repeatable and controllable deposition process.
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