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Ultrasonic spraying stands out in the realm of mainstream coating technologies due to its unique advantages, shining across numerous coating application fields. To better adapt to various application processes, ultrasonic spray nozzles are categorized into different types. Besides varying spray widths, there are models specifically designed for particular coating processes. For instance, the D Series conemist ultrasonic spray nozzle is developed to accommodate substrates with structured surfaces
Figure 1. The Conemist ultrsaonic spray nozzle by Siansonic Technology
The conemist ultrasonic spray nozzle is a "rotary spray" head. Compared to other types, it creates a uniform rotating airflow through a special vortex pathway. This design allows the ultrasonically atomized mist to be emitted in a cyclone pattern by the rotating airflow, resulting in a spiral-shaped spray. While expanding the coating area, it also allows for coating non-horizontal surfaces such as vertical and inclined planes.
A typical application of the conemist ultrasonic spray nozzle is the application of photoresist on semiconductor wafers, particularly suitable for wafers with structured surfaces. This coating requirement, using either the spin-coating process or conventional ultrasonic spraying, is limited to completely flat surfaces. The D Series ultrasonic spray nozzle's special mist shape allows for better adhesion of photoresist on non-horizontal surfaces, forming enveloping coatings. Additionally, for wet film process scenarios, the rotary airflow prevents disturbances to the leveling process of the wet film already adhered to the surface, resulting in a uniform, smooth coating.
The Siansonic conemist ultrasonic spray nozzle (D Series) is suited for multiple coating applications including semiconductor photoresist, thin-film solar cells, anti-reflective films, thermal insulation films, superhydrophobic coatings, and PCB flux.
