Ultrasonic Photoresist Coating for MEMs, Wafers and Other Substrates with Various Topographies

Compared with traditional coating processes such as spin coating and dip coating, Siansonic ultrasonic coating technology for deposition of photoresist spray coating onto semiconductors has the advantages of high uniformity, excellence coverage of microstructure and controllable coating area. In the past 10 years, it has been fully proved that the photoresist coating on the surface of 3D microstructure by ultrasonic coating technology is significantly higher than the traditional spin coating process in terms of encapsulation and uniformity of microstructure. Siansonic ultrasonic coating systems can be used for surface coatings of planar and 3D structural substrates including silicon wafer, glass, ceramics, metal and other materials. Typical photoresist spray coating applications include silicon wafers, MEMS, lens, microfluidic chips, filters, etc. Ultrasonic coating is a simple, effective, economical and reliable solution for photoresist coating. Siansonic ultrasonic coating systems can precisely control the flow rate, coating speed and deposition amount by using advanced layering technique. The low-speed and soft ultrasonic atomization technology makes the spray accurate and controllable, producing ultra-thin and uniform photoresist coating with little overspray. Direct photoresist spray coating using ultrasonic atomization technology is proven to be a reliable and effective method for depositing photoresist on 3D microstructure, consequently reducing device failures caused by overexposure of the metal to etchant.

Advantages of Siansonic ultrasonic nozzles in photoresist spray coating process

• Uniform photoresist coating coverage of various topographies.

• Ability to homogeneously coat high aspect ratio trenches

• Non-clogging spray nozzles with low maintenance cost

• Capable of coating thick layers in tens of microns with high uniformity.

• Highly controllable and reliable photoresist coating process

The core of all Siansonic ultrasonic photoresist coating systems is our ultrasonic spray nozzle. The ultrasonic nozzles solve the clogging issues in conventional air spray nozzles. In addition, since ultrasonic nozzles do not need pressure for atomization, and have a very narrow droplet size distribution, it is able to further improve the uniformity of the deposition layer. Click to learn more about how our ultrasonic nozzles work.